ST0903 is a two-component epoxy functional thermal conductive adhesive. It possesses high thermal efficiency and adhesive strength. It has been widely used in LED, photovoltaic, semiconductor and other module and electronic proucts which require high thermal conductivity performance.




High thermal conductivity 30W/m.K

High adhesive strength: especially suitable for bonding between different materials like aluminium, copper, nickel, ceramic, silver etc.

ST0903 is high stability with slow attenuation. It also satisfies the requirement of long-time usage under the condition of thermal-cycle.


High electromagnetic compatibility to improve safety level.

Solvent-free, no volatile and meets the EU environmental protection certification standards. (RoHS, REACH, IATA)

Since ST0903 is curing at room temperature or low temperature, it prevents electronic circuit from performance degradation caused by high-temperature influence.

It is suitable for automatic dispensing, stencil printing and manual etc. which improve product consistency.

Low heat liberation of curing process and shrinkage rate to meet the technological requirements of precision device

Good water resistance


Life Time and Storage temperature

Cure condition

Operation  time

1 month @ 25°C seal avoid light

72 hrs @ 25°C

3 hrs

3 months @ 10°C seal avoid light

45 mins @ 80°C


12 months @ -10°C seal avoid light

10 mins @ 150°C



Standard package

50ml / 100g  2:1 two-component tube with 1 Mixpack



Each standard ST0903 is able to cover about 5000cm².

Assume each SMT area is 1.0cm², one standard ST0903 can cover about 5000 products.

Formula:  SMT quantity = Total covering area / unit SMT area

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