S800 is a one-component epoxy functional thermal conductive adhesive. It possesses high thermal efficiency and adhesive strength. It has been widely used in LED, photovoltaic, semiconductor and other module and electronic proucts which require high thermal conductivity performance.




High thermal conductivity 1.20W/m.K(before cured)  and 2.70W/m.K(after cured)

High adhesive strength: especially suitable for bonding between different materials like aluminium, copper, nickel, ceramic, silver etc.

S800 is high stability with slow attenuation. It also satisfies the requirement of long-time usage under the condition of thermal-cycle.


High electromagnetic compatibility to improve safety level.

Solvent-free, no volatile and meets the EU environmental protection certification standards. (RoHS, REACH, IATA)

Since S800 is curing at room temperature or low temperature, it prevents electronic circuit from performance degradation caused by high-temperature influence.

It is suitable for automatic dispensing, stencil printing and manual etc. which improve product consistency.

Low heat liberation of curing process and shrinkage rate to meet the technological requirements of precision device

Good water resistance  


Life Time and Storage temperature

Cure condition

Operation  time

3month     @ 30°C seal avoid light

90 mins @ 100°C

>120 hours

12 months @ 25°C seal avoid light

60 mins @ 120°C


24 months @ -10°C seal avoid light


15 mins @ 150°C



Standard package

Big: 1000ml /1000g one-component canning

Small: 330ml / 330g one-component tube



Each standard S800 is able to cover about 100,000cm².

Assume each SMT area is 1.0cm², one standard S800 can cover about 100,000 products. 

Formula:  SMT quantity = Total covering area / unit SMT area

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